• DocumentCode
    971952
  • Title

    Measurements of crosstalk between closely-packed lossy microstrips on silicon substrates

  • Author

    Lin, M.S. ; Engvik, A.H.

  • Author_Institution
    AT&T Bell Lab., Murray Hill, NJ, USA
  • Volume
    26
  • Issue
    11
  • fYear
    1990
  • fDate
    5/24/1990 12:00:00 AM
  • Firstpage
    714
  • Lastpage
    716
  • Abstract
    The measured near-end and far-end crosstalks for closely-packed microstrips are reported. The near-end crosstalk is less than 10% and the far-end crosstalk is less than 5% (of the driven signal) between two microstrips with 10 mu m width and 10 mu m spacing, when the active line is driven by a fast step pulse with approximately 40 ps rise time. Based on their measurements, the authors believe that closely-packed lossy microstrips can be used for high speed digital signal transmission, without much concern of crosstalk.
  • Keywords
    crosstalk; electromagnetic compatibility; silicon; strip lines; substrates; waveguide theory; 10 micron; 40 ps; Si substrates; VLSI chips interconnection; closely-packed lossy microstrips; closely-packed microstrips; crosstalk measurements; far-end crosstalk; fast step pulse; high speed digital signal transmission; near-end crosstalk; rise time; spacing; width;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19900466
  • Filename
    106035