Characteristics of packaged 256 kbit enhanced density 3 µm bubble devices with improved performance

The design and functional characteristics of a packaged 256 kbit enhanced density 3 μm bubble device are presented. The chip is designed to be compatible with the 256 kbit commercial product of Texas Instruments Incorporated. Measurements on the module are made at 100 KHz over the temperature range 0°C to 60°C using a computer controlled test system. It is shown that the performance of this device design compares very favorably with the performance of conventional 3 μm 256 kbit chip designs. This confirms the feasibility of the enhanced density concept.