DocumentCode :
973373
Title :
A Multiple Particle Model for the Prediction of Electrical Contact Resistance in Anisotropic Conductive Adhesive Assemblies
Author :
Chin, Melida ; Hu, S. Jack
Author_Institution :
Michigan Univ., Ann Arbor
Volume :
30
Issue :
4
fYear :
2007
Firstpage :
745
Lastpage :
753
Abstract :
Accurate prediction of electrical contact resistance in anisotropic conductive adhesive (ACA) assemblies requires realistic models that include multiple particles between mating conductive tracks. In this paper, theoretical and finite element analyses are used to determine the electrical contact resistance in multiparticle ACA assemblies considering the effect of non-identical contact areas, elastic recovery, electrical interaction between the particles, and electrical interaction between the particles and the edges of the conductive tracks (edge effect). Parameters such as the number of particles, spatial distribution of the particles, and magnitude of the initial bonding force are evaluated. It is found that the spatial distribution of the particles plays a very important role in the rate at which the resistance decreases when either the number of particles or the magnitude of the initial bonding force is increased.
Keywords :
adhesive bonding; assembling; contact resistance; electrical contacts; electronics packaging; finite element analysis; anisotropic conductive adhesive assemblies; bonding force; edge effect; elastic recovery; electrical contact resistance; electrical interaction; finite element analysis; mating conductive tracks; multiparticle ACA assemblies; multiple particle model; nonidentical contact areas; spatial particle distribution; Anisotropic magnetoresistance; Assembly; Bonding forces; Conductive adhesives; Contact resistance; Elastic recovery; Electric resistance; Finite element methods; Particle tracking; Predictive models; Anisotropic conductive adhesive (ACA); bonding force; contact area; edge effect; elastic recovery; electrical contact resistance; electrical interaction; spatial distribution;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2007.910136
Filename :
4381433
Link To Document :
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