Title :
Trends in silicon-on-silicon multichip modules
Author :
Frye, Robert C. ; Tai, King L. ; Lau, Maureen Y. ; Gabara, Thaddeus J.
Author_Institution :
AT&T Bell Labs., Murray Hill, NJ, USA
Abstract :
Three example applications of silicon-on-silicon multichip modules are discussed: a module used in a parallel processor, a low-cost silicon module for a high-volume consumer product application, and a high-performance digital telecommunications module. These applications illustrate the changes occurring in this technology and the forces that are driving these changes.<>
Keywords :
VLSI; multichip modules; parallel machines; consumer product; digital telecommunications module; multichip modules; parallel processor; silicon-on-silicon; CMOS technology; Capacitance; Clocks; Electric resistance; Integrated circuit interconnections; Integrated circuit technology; Multichip modules; Thermal management; Transmission lines; Very large scale integration;
Journal_Title :
Design & Test of Computers, IEEE
