DocumentCode :
975162
Title :
Substrate Integrated Waveguide-to-Microstrip Transition in Multilayer Substrate
Author :
Ding, Yan ; Wu, Ke
Author_Institution :
Ecole Polytech. de Montreal, Montreal
Volume :
55
Issue :
12
fYear :
2007
Firstpage :
2839
Lastpage :
2844
Abstract :
This paper presents a novel transition between a microstrip line and a substrate integrated waveguide (SIW) in a multilayer substrate design environment. In order to achieve a low-loss broadband response, the transition, consisting of a tapered or multisectional ridged SIW and a tapered microstrip line, is modeled and designed by simultaneously considering both impedance matching and field matching. Characteristic impedance and guided wavelength calculated by using closed-form expressions based on a transverse resonant method are used to develop our design procedure. Effective broad bandwidth is obtained in two examples developed in this study, which are validated with simulated and measured results. This transition provides a simple way to design substrate integrated circuits with buried microstrip circuits in the multilayer substrate in which any ratio of impedance transform can be anticipated.
Keywords :
impedance matching; microstrip transitions; microwave integrated circuits; substrates; waveguide transitions; buried microstrip circuits; characteristic impedance; closed-form expressions; field matching; guided wavelength; impedance matching; integrated circuits design; low-loss broadband response; multilayer substrate; ridged waveguide; substrate integrated waveguide-to-microstrip transition; tapered microstrip line; transverse resonant method; Bandwidth; Circuit simulation; Closed-form solution; Impedance matching; Integrated circuit measurements; Microstrip; Nonhomogeneous media; Resonance; Waveguide transitions; Wavelength measurement; Microstrip line; multilayer structure; ridged waveguide; substrate integrated circuits (SICs); substrate integrated waveguide (SIW); transition;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/TMTT.2007.909878
Filename :
4383172
Link To Document :
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