Title :
The role of universities in electronic packaging engineering
Author :
Prince, J.L. ; Hamilton, Douglas J. ; Matz, Eileen M. ; Staszak, Zbigniew J.
Author_Institution :
University of Arizona, Tucson, AZ, USA
Abstract :
Characteristics of present and future problems and directions in Level 1 and Level 2 packaging are discussed. Research areas are delineated, and problems amenable to attack by universities are suggested. An example of an existing university research program is given. Methods for universities to develop and implement courses in electronic packaging are discussed. A three-course core presently in use is described; this core can be used to provide Electronic Packaging Engineering emphasis in the M.S. programs of a number of different departments. Guidelines are suggested for the development of educational programs in Electronic Packaging Engineering, including use of industrial interactions and video education.
Keywords :
Costs; Educational institutions; Educational programs; Electronics packaging; Integrated circuit interconnections; Manufacturing; Power engineering and energy; Power system interconnection; Power system reliability; Silicon;
Journal_Title :
Proceedings of the IEEE
DOI :
10.1109/PROC.1985.13302