DocumentCode
976885
Title
Foreword
Author
Li, Luoqing
Volume
30
Issue
4
fYear
2007
Firstpage
555
Lastpage
555
Abstract
The five papers in this special section were presented at the 2005 Electronic Components and Technology Conference.
Keywords
Capacitors; Ceramics; Circuit simulation; Components, Packaging, and Manufacturing Technology Society; Costs; Dielectric thin films; Electronics packaging; Fabrication; Paper technology; Substrates;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2007.910903
Filename
4383343
Link To Document