Abstract :
The five papers in this special section were presented at the 2005 Electronic Components and Technology Conference.
Keywords :
Capacitors; Ceramics; Circuit simulation; Components, Packaging, and Manufacturing Technology Society; Costs; Dielectric thin films; Electronics packaging; Fabrication; Paper technology; Substrates;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2007.910903
