Author :
Raad, Peter E. ; Volz, Sebastian
Abstract :
The thirty-six papers in this special section are devoted to thermal benchmarking.
Keywords :
Diodes; Electronic packaging thermal management; Immune system; Photonic integrated circuits; Reflectometry; Temperature measurement; Temperature sensors; Thermal resistance; Transient analysis; Voltage;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2007.912044
