DocumentCode
977170
Title
Encapsulant-free annealing of ion-implanted GaP
Author
Myers, D.R. ; Biefeld, R.M. ; Zipperian, T.E. ; Dawson, L.R.
Author_Institution
Sandia National Laboratories, Albuquerque, USA
Volume
18
Issue
8
fYear
1982
Firstpage
323
Lastpage
324
Abstract
GaP diodes were fabricated by Mg+ implantation and controlled atmosphere annealing. At room temperature, these diodes emit green light under forward bias, with an ideality factor of 2.0. Reverse breakdown voltages are 180 V, with a measured reverse leakage current density of 4.8 à 10¿9 A/cm2 at a bias of ¿3 V. The diodes retain good electrical characteristics at 400°C.
Keywords
III-V semiconductors; annealing; gallium compounds; ion implantation; magnesium; semiconductor technology; GaP LED; Mg+ implantation; controlled atmosphere annealing; encapsulant free annealing; high temperature electronics; ideality factor; ion-implanted GaP; operation to 400 degree C;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19820220
Filename
4246352
Link To Document