• DocumentCode
    977170
  • Title

    Encapsulant-free annealing of ion-implanted GaP

  • Author

    Myers, D.R. ; Biefeld, R.M. ; Zipperian, T.E. ; Dawson, L.R.

  • Author_Institution
    Sandia National Laboratories, Albuquerque, USA
  • Volume
    18
  • Issue
    8
  • fYear
    1982
  • Firstpage
    323
  • Lastpage
    324
  • Abstract
    GaP diodes were fabricated by Mg+ implantation and controlled atmosphere annealing. At room temperature, these diodes emit green light under forward bias, with an ideality factor of 2.0. Reverse breakdown voltages are 180 V, with a measured reverse leakage current density of 4.8 × 10¿9 A/cm2 at a bias of ¿3 V. The diodes retain good electrical characteristics at 400°C.
  • Keywords
    III-V semiconductors; annealing; gallium compounds; ion implantation; magnesium; semiconductor technology; GaP LED; Mg+ implantation; controlled atmosphere annealing; encapsulant free annealing; high temperature electronics; ideality factor; ion-implanted GaP; operation to 400 degree C;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19820220
  • Filename
    4246352