• DocumentCode
    978380
  • Title

    Chip making´s wet new world

  • Author

    Geppert, L.

  • Volume
    41
  • Issue
    5
  • fYear
    2004
  • fDate
    5/1/2004 12:00:00 AM
  • Firstpage
    29
  • Lastpage
    33
  • Abstract
    Putting a drop of water between the lens and the silicon wafer allows a system to resolve lines a few hundred atoms wide. Researchers are counting on it to lift the technology from its last legs and carry it through the end of the decade.
  • Keywords
    integrated circuit technology; photolithography; wafer-scale integration; IC sites; immersion lithography; light beam; lithographic system; optical lithography; optical wavelength reduction; refractive index; wafer packaging; Business; Integrated circuit modeling; Integrated circuit technology; Lithography; Manufacturing; Optical films; Silicon; Space technology; Ultraviolet sources; Wires;
  • fLanguage
    English
  • Journal_Title
    Spectrum, IEEE
  • Publisher
    ieee
  • ISSN
    0018-9235
  • Type

    jour

  • DOI
    10.1109/MSPEC.2004.1296011
  • Filename
    1296011
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=978380