DocumentCode :
979581
Title :
A 2055-V (at 0.7 \\hbox {mA/cm}^{2} ) 24-A (at 706 \\hbox {W/cm}^{2} ) Normally On 4H-SiC JFE
Author :
Veliadis, V. ; Snook, M. ; McNutt, T. ; Hearne, H. ; Potyraj, P. ; Lelis, Aivars ; Scozzie, C.
Author_Institution :
Northrop Grumman Adv. Technol. Lab., Linthicum, MD
Volume :
29
Issue :
12
fYear :
2008
Firstpage :
1325
Lastpage :
1327
Abstract :
A normally on 4H-SiC vertical-junction field-effect transistor (VJFET) of 6.8-mm2 active area was manufactured in seven photolithographic levels with no epitaxial regrowth and a single masked ion-implantation event. The VJFET exhibits low leakage currents with very sharp onsets of voltage breakdowns. At a forward gate bias of 2.5 V, the VJFET outputs 24 A (353 A/cm2) at a forward drain-voltage drop of 2 V (706 W/cm2), with a current gain of ID/IG = 21818, and a specific ON-state resistance of 5.7 mOmegaldrcm2. Self-aligned floating guard rings provide edge termination that blocks 2055 V at a gate bias of -37 V and a drain-current density of 0.7 mA/cm2. This blocking voltage corresponds to 94.4% of the VJFET´s 11.7-mum/3.46 times 1015-cm3 SiC drift layer limit and is the highest reported blocking-voltage efficiency of any SiC power device under similar drain-current-density conditions.
Keywords :
ion implantation; junction gate field effect transistors; photolithography; power semiconductor devices; semiconductor doping; silicon compounds; SiC; blocking-voltage capability; current 24 A; normally-on JFET; power device; seven photolithographic levels; single masked ion-implantation; vertical-junction field-effect transistor; voltage -37 V; voltage 2.5 V; voltage 2055 V; 4H-SiC; Edge termination; guard rings; high current; high power; high voltage; junction field-effect transistor (JFET); large area; normally on; vertical channel;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2008.2006766
Filename :
4667668
Link To Document :
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