System-on-Packaging with Electroabsorption Modulator for a 60-GHz Band Radio-Over-Fiber Link

Author

Choi, Kwang-Seong ; Chung, Yong-Duck ; Jun, Dong-Suk ; Moon, Jong-Tae ; Kim, Jeha ; Yu, Hyun-Kyu ; Park, Hyo-Hoon

Author_Institution

Electron. & Telecommun. Res. Inst., Daejeon

Volume

31

Issue

1

fYear

2008

Firstpage

163

Lastpage

169

Abstract

A system-on-packaging (SoP) with an electroabsorption modulator (EAM) for a 60 GHz band radio-over-fiber (RoF) link is described. The system consists of an EAM device, a microstrip filter, and a low noise amplifier (LNA). The microstrip filter was used to achieve impedance matching between the EAM device and the LNA and to reject the local oscillator (LO) frequency of the heterodyne system. The frequency response and the effect of the EAM bias voltage were measured for a simple RF/optical link. A 60 GHz band RoF link with 2.5 GHz intermediate frequency (IF) was prepared to measure the transmission characteristics of the 16 QAM data.

Keywords

electro-optical modulation; electroabsorption; frequency response; impedance matching; low noise amplifiers; microstrip filters; millimetre wave devices; radio-over-fibre; system-in-package; electroabsorption modulator; frequency 2.5 GHz; frequency 60 GHz; frequency response; impedance matching; local oscillator; low noise amplifier; microstrip filter; radio-over-fiber link; system-on-package; 60-GHz band radio-over-fiber (RoF); Electroabsorption modulator (EAM); frequency response; impedance matching; system-on-packaging (SoP);

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2007.909447

Filename

4384460