• DocumentCode
    9815
  • Title

    Ultra-Wideband Suppression of Power/Ground Noise in High-Speed Circuits Using a Novel Electromagnetic Bandgap Power Plane

  • Author

    Yongrong Shi ; Wanchun Tang ; Sheng Liu ; Xin Rao ; Chow, Yung Leonard

  • Author_Institution
    Dept. of Commun. Eng., Nanjing Univ. of Sci. & Technol., Nanjing, China
  • Volume
    3
  • Issue
    4
  • fYear
    2013
  • fDate
    Apr-13
  • Firstpage
    653
  • Lastpage
    660
  • Abstract
    A power/ground plane pair is proposed using a novel planar electromagnetic bandgap (EBG) structure for isolating the power-to-ground noise (PGN) in high-speed circuits. Each unit cell of the novel EBG is designed by etching slots in a “C” shape on the power plane while maintaining the ground plane solid. Without cascading hybrid periodic structures, it shows an efficient mitigation of PGN within an ultra-wideband frequency range of 0.25-2.18 GHz. In this paper, the equivalent circuit model and cavity mode analysis for the novel EBG unit cell are given to quickly predict the lower and upper bound cutoff frequency, respectively. The dispersion diagram of the proposed EBG structure is validated by insertion loss measurements with ports at different locations of the unit cell for different modes. The result shows that there is a good consistency between the simulated and measured results.
  • Keywords
    equivalent circuits; interference suppression; photonic band gap; EBG structure; EBG unit cell; PGN; cavity mode analysis; dispersion diagram; electromagnetic bandgap power plane; equivalent circuit model; etching slots; frequency 0.25 GHz to 2.18 GHz; high-speed circuit; hybrid periodic structure; insertion loss measurement; power-to-ground noise; ultra-wideband suppression; Bridge circuits; Dispersion; Equivalent circuits; Inductance; Integrated circuit modeling; Metamaterials; Periodic structures; Electromagnetic bandgap (EBG); high-speed circuits; power integrity; power-to-ground noise (PGN);
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2012.2235529
  • Filename
    6410398