DocumentCode :
981853
Title :
Nanopackaging Simulation
Author :
Bailey, Chris ; Lu, Hua
Volume :
3
Issue :
2
fYear :
2009
fDate :
6/1/2009 12:00:00 AM
Firstpage :
34
Lastpage :
37
Abstract :
Simulation tools as part of a virtual prototyping environment enable scientists and design engineers to answer "what-if" questions before actual costly experimentation and physical prototyping. Over the last 40 years, there has been an explosion in the use of simulation tools to predict electrical, thermal, and mechanical behavior of materials and the reliability of devices that contain microsystems. These tools are based on classical continuum mechanics (e.g., the finite element method), atomistic mechanics [e.g., classical molecular dynamics (MD)], or quantum mechanics (e.g., the density functional method). Figure 1 details the lengths and timescales at which each of these tools should be used.
Keywords :
Internet; circuit reliability; electronic engineering computing; electronics packaging; finite element analysis; nanotechnology; Web-based resource; electrical properties; electronics packaging; finite element methods; mechanical properties; microsystem reliability; nanopackaging simulation; nanoscale simulations; scale modeling packages; temperature gradients; thermal properties; Application software; Computational modeling; Finite element methods; Materials reliability; Mechanical factors; Nanocomposites; Packaging; Predictive models; Quantum mechanics; Thermal stresses;
fLanguage :
English
Journal_Title :
Nanotechnology Magazine, IEEE
Publisher :
ieee
ISSN :
1932-4510
Type :
jour
DOI :
10.1109/MNANO.2009.932413
Filename :
5036189
Link To Document :
بازگشت