DocumentCode
982201
Title
A procedure for modeling material junctions in 3-D surface integral equation approaches
Author
Carr, M. ; Topsakal, E. ; Volakis, J.L.
Author_Institution
Electr. Eng. & Comput. Sci. Dept., Univ. of Michigan, Ann Arbor, MI, USA
Volume
52
Issue
5
fYear
2004
fDate
5/1/2004 12:00:00 AM
Firstpage
1374
Lastpage
1378
Abstract
Surface integral equations become cumbersome to solve when arbitrary combinations of materials, and complicated arrangements of junctions between those materials, are considered. This paper describes a straightforward approach for generalizing integral equation techniques to handle any combinations of materials with junctions. Particular attention is focused on a unique, easily implemented junction resolution algorithm that maps each basis function coefficient to one or more unknowns. Three examples are presented for validation purposes.
Keywords
boundary integral equations; dielectric materials; electromagnetic wave scattering; impedance matrix; method of moments; 3-D surface integral equation; MoM; dielectric material; junction resolution algorithm; method of moment; Boundary conditions; Conducting materials; Dielectric materials; Geometry; Integral equations; Joining materials; Magnetic materials; Moment methods; Numerical analysis; Radar scattering; Dielectric materials; MoM; integral equations; method of moments; numerical analysis; radar scattering;
fLanguage
English
Journal_Title
Antennas and Propagation, IEEE Transactions on
Publisher
ieee
ISSN
0018-926X
Type
jour
DOI
10.1109/TAP.2004.827247
Filename
1296851
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