A Scalable 0.128–1 Tb/s, 0.8–2.6 pJ/bit, 64-Lane Parallel I/O in 32-nm CMOS

A scalable 64-lane chip-to-chip I/O, with per-lane data rate of 2-16 Gb/s is demonstrated in 32-nm low-power CMOS technology. At maximum aggregate bandwidth of 1.024 Tb/s across 50-cm channel length, the link consumes 2.7 W from a 1.08-V supply, corresponding to 2.6 pJ/bit. As bandwidth demand decreases, scaling the per-lane data rate to 4 Gb/s and power supply to 0.65 V provides 1/4 of the maximum bandwidth while consuming 0.2 W. Across a 1-m channel, the link operates at a maximum per-lane data rate of 16 Gb/s; thus, providing up to 1.024 Tb/s of aggregate bandwidth with 3.2 pJ/bit power efficiency from a 1.15-V supply. A length-matched dense interconnect topology allows clocking to be shared across multiple lanes to reduce area and power. Reconfigurable current/voltage mode transmitter driver and CMOS clocking enable a highly scalable power-efficient link. Optional low-dropout regulators provide >22-dB supply noise rejection at the package resonance frequency of 200 MHz. System-level optimization of duty-cycle and quadrature error correctors across the clock hierarchy provides optimized clock phase placement and, thus, enhances link performance and power. A lane failover mechanism provides design robustness to mitigate channel or circuit defects. The active circuitry occupies 1.3 mm².