DocumentCode
983158
Title
Network representations of LIGBT structures for CAD of power integrated circuits
Author
Fossum, Jerry G. ; McDonald, Robert J. ; Shibib, M. Ayman
Author_Institution
Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
Volume
35
Issue
4
fYear
1988
fDate
4/1/1988 12:00:00 AM
Firstpage
507
Lastpage
515
Abstract
To enable computer-aided design (CAD) of power integrated circuits, physical models for lateral high-voltage/power (HV/P) devices, in particular lateral insulated-gate bipolar transistor (LIGBT) structures, are developed and implemented in SPICE. The models are charge-based, and, via regional partitioning, account for the unique features of HV/P devices unaccounted for in conventional equivalent-circuit models. The implementation of the models in the circuit simulator is flexible and allows these features (e.g. multidimensional carrier flow, conductivity modulation, latchup, transcapacitance) to be simulated without having to sacrifice much physics through excessive empiricism. Device measurement of specially designed test structures, supplemented with two-dimensional numerical device simulations, support the modeling methodology and the model parameter extraction
Keywords
CAD; bipolar transistors; equivalent circuits; power integrated circuits; power transistors; semiconductor device models; 2D simulation; CAD; LIGBT structures; SPICE; computer-aided design; conductivity modulation; latchup; lateral insulated-gate bipolar transistor; model parameter extraction; modeling methodology; multidimensional carrier flow; network representation; physical models; power device unique features; power integrated circuits; regional partitioning; specially designed test structures; transcapacitance; two-dimensional numerical device simulations; Circuit simulation; Conductivity; Design automation; Flexible printed circuits; Insulated gate bipolar transistors; Insulation; Integrated circuit modeling; Multidimensional systems; Power integrated circuits; SPICE;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.2486
Filename
2486
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