• DocumentCode
    983158
  • Title

    Network representations of LIGBT structures for CAD of power integrated circuits

  • Author

    Fossum, Jerry G. ; McDonald, Robert J. ; Shibib, M. Ayman

  • Author_Institution
    Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
  • Volume
    35
  • Issue
    4
  • fYear
    1988
  • fDate
    4/1/1988 12:00:00 AM
  • Firstpage
    507
  • Lastpage
    515
  • Abstract
    To enable computer-aided design (CAD) of power integrated circuits, physical models for lateral high-voltage/power (HV/P) devices, in particular lateral insulated-gate bipolar transistor (LIGBT) structures, are developed and implemented in SPICE. The models are charge-based, and, via regional partitioning, account for the unique features of HV/P devices unaccounted for in conventional equivalent-circuit models. The implementation of the models in the circuit simulator is flexible and allows these features (e.g. multidimensional carrier flow, conductivity modulation, latchup, transcapacitance) to be simulated without having to sacrifice much physics through excessive empiricism. Device measurement of specially designed test structures, supplemented with two-dimensional numerical device simulations, support the modeling methodology and the model parameter extraction
  • Keywords
    CAD; bipolar transistors; equivalent circuits; power integrated circuits; power transistors; semiconductor device models; 2D simulation; CAD; LIGBT structures; SPICE; computer-aided design; conductivity modulation; latchup; lateral insulated-gate bipolar transistor; model parameter extraction; modeling methodology; multidimensional carrier flow; network representation; physical models; power device unique features; power integrated circuits; regional partitioning; specially designed test structures; transcapacitance; two-dimensional numerical device simulations; Circuit simulation; Conductivity; Design automation; Flexible printed circuits; Insulated gate bipolar transistors; Insulation; Integrated circuit modeling; Multidimensional systems; Power integrated circuits; SPICE;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.2486
  • Filename
    2486