DocumentCode :
983278
Title :
Defect-coupled diffusion at high concentrations
Author :
Giles, Martin D.
Author_Institution :
AT&T Bell Lab., Murray Hill, NJ, USA
Volume :
8
Issue :
5
fYear :
1989
fDate :
5/1/1989 12:00:00 AM
Firstpage :
460
Lastpage :
467
Abstract :
The role of point defects during silicon dopant diffusion at high dopant concentrations is considered. Starting from the basic reaction equations for the formation of dopant-defect pairs, the effective dopant diffusivity is derived. Consideration of these equations shows why a concentration-dependent diffusivity model is often sufficient for modeling diffusion. Consideration of these equations also shows the effect of processes such as oxidation, which inject defects at the surface. Analysis of oxidation-enhanced diffusivity experiments under extrinsic conditions allows the silicon self-interstitial energy levels to be extracted directly at diffusion temperatures
Keywords :
elemental semiconductors; semiconductor doping; silicon; Si doping; basic reaction equations; concentration-dependent diffusivity model; diffusion temperatures; dopant diffusion; effect of processes; effective dopant diffusivity; extrinsic conditions; formation of dopant-defect pairs; high dopant concentrations; modeling diffusion; oxidation; oxidation-enhanced diffusivity experiments; role of point defects; self-interstitial energy levels; semiconductors; Electrons; Electrostatics; Energy states; Equations; Helium; Oxidation; Semiconductor process modeling; Silicon; Spontaneous emission; Temperature;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/43.24874
Filename :
24874
Link To Document :
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