Title :
New approaches in a 3-D one-carrier device solver
Author :
Wu, Ke-Chih ; Lucas, Robert F. ; Wang, Ze-Yi ; Dutton, Robert W.
Author_Institution :
Integrated Circuits Lab., Stanford Univ., CA, USA
fDate :
5/1/1989 12:00:00 AM
Abstract :
A 3-D one-carrier device solver has been developed on an Intel iPSC2 hypercube multiprocessor which can handle over 130 K nodes. CPU time averages 20 min per bias point on a 50 K-node MOSFET example. Slotboom variables are used in conjunction with the Scharfetter-Gummel current discretization scheme. A scaling scheme is proposed which produces n, p variables from the Slotboom variables. An improved damped-Newton scheme, which maintains the iteration numbers at below fifteen for high gate biases, is used in solving Poisson´s equation. The performance of a previously proposed initial guess scheme is improved through the use of a novel update strategy during the Poisson solution stage after the initial guess step. This improvement allows stable calculation for voltage steps as high as 5 V. A modified singular perturbation scheme (MSP) has been proposed whose implementation speeds up the convergence under high-Vgs and -V ds bias conditions by a factor of three to six. A block matrix analysis of the MSP scheme yields insight into its performance
Keywords :
digital simulation; electronic engineering computing; insulated gate field effect transistors; semiconductor device models; 3-D one-carrier device solver; CPU time; Intel iPSC2; MOSFET example; Poisson solution stage; Poisson´s equation; Scharfetter-Gummel current discretization scheme; Slotboom variables; bias conditions; block matrix analysis; convergence speed up; damped-Newton scheme; high gate biases; hypercube multiprocessor; initial guess step; performance; scaling scheme; singular perturbation scheme; stable calculation; update strategy; Acceleration; Costs; FETs; Helium; Hypercubes; Performance analysis; Poisson equations; Supercomputers; Very large scale integration; Voltage;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on