Title :
Fast and Optimal Redundant Via Insertion
Author :
Lee, Kuang-Yao ; Koh, Cheng-Kok ; Wang, Ting-Chi ; Chao, Kai-Yuan
Author_Institution :
Dept. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu
Abstract :
Redundant via insertion is highly effective in improving chip yield and reliability. In this paper, we study the problem of double-cut via insertion (DVI) in a post-routing stage, where a single via can have, at most, one redundant via inserted next to it and the goal is to insert as many redundant vias as possible. The DVI problem can be naturally formulated as a zero-one integer linear program (0-1 ILP). Our main contributions are acceleration methods for reducing the problem size and the number of constraints. Moreover, we extend the 0-1 ILP formulation to handle via density constraints. Experimental results show that our 0-1 ILP is very efficient in computing an optimal DVI solution, with up to 73.98 times speedup over existing heuristic algorithms.
Keywords :
integer programming; integrated circuit reliability; integrated circuit yield; linear programming; redundancy; acceleration methods; chip reliability; chip yield; double-cut via insertion; heuristic algorithms; optimal DVI solution; redundant via insertion; via density constraints; zero-one integer linear program; Acceleration; Added delay; Chaos; Circuits; Electromigration; Helium; Heuristic algorithms; Manufacturing processes; Page description languages; Routing; Integer linear program (ILP); redundant via insertion; via density;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
DOI :
10.1109/TCAD.2008.2006151