DocumentCode
985387
Title
Off-state instabilities in thermally nitrided-oxide n-MOSFETs
Author
Ma, Z.J. ; Lai, P.T. ; Cheng, Y.C.
Author_Institution
Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
Volume
40
Issue
1
fYear
1993
fDate
1/1/1993 12:00:00 AM
Firstpage
125
Lastpage
130
Abstract
The significant off-stage gate current of nitrided-oxide n-MOSFETs can be attributed to severe hot-hole injection into the gate oxide during band-to-band (B-B) tunneling due to a nitridation-induced lowering of the barrier height for hole injection. Some of the injected holes are even trapped in the gate oxide above the deep-depletion layer of the drain and thus decrease the gate-induced drain leakage (GIDL) current. A subsequent hot-electron injection into the gate oxide can neutralize these trapped holes and make the reduced GIDL current recover, even increase beyond the original value. The proposed mechanism of the GIDL degradation and recovery behaviors can be confirmed by the observed change in the ratio of the substrate to source currents, as well as by the field-distribution analysis of the gate oxide under stressing
Keywords
hole traps; hot carriers; insulated gate field effect transistors; semiconductor-insulator boundaries; stability; tunnelling; GIDL current; NMOS devices; SiNO; band-to-band tunnelling; barrier height; field-distribution analysis; gate oxide; gate-induced drain leakage current; hot-electron injection; hot-hole injection; n-MOSFETs; nitridation-induced lowering; off-stage gate current; offstate instabilities; thermally nitrided-oxide; trapped holes; Degradation; Electron traps; Hot carriers; MOS devices; MOSFET circuits; Rapid thermal processing; Secondary generated hot electron injection; Thermal stresses; Tunneling; Voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.249434
Filename
249434
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