DocumentCode :
985450
Title :
Balancing Opportunities and Risks in Component-Based Software Development
Author :
Boehm, Barry ; Bhuta, Jesal
Author_Institution :
Univ. of Southern California, Los Angeles, CA
Volume :
25
Issue :
6
fYear :
2008
Firstpage :
56
Lastpage :
63
Abstract :
The increasingly rapid change in information technology makes it essential for software development projects to continuously monitor and adapt to new sources of opportunity and risk. Software projects and organizations can increase their success rates in software development by better assessing and balancing their opportunities and risks. The authors summarize the incremental commitment model (ICM), a process framework for improved project monitoring and decision making based on balancing opportunities and risks. They give an example of how the ICM framework can improve component-based development choices based on assessment of opportunities and risks. They show how different opportunistic solutions result from different stakeholder value propositions. They elaborate on the risks involved in architectural mismatches among components, present a tool called the Integration Studio (iStudio) that enables projects to assess the most common sources of architectural mismatch between components. Finally, they present representative examples of its use.
Keywords :
decision making; object-oriented programming; project management; risk management; software development management; Integration Studio; component-based software development; decision making; iStudio; incremental commitment model; project monitoring; risk management; software projects; Control systems; Costs; Decision making; Hardware; Mashups; Monitoring; Programming; Project management; Risk management; Shape control; COTS; ICM; Incremental Commitment Model; component-based software development; concurrent engineering; integration; life-cycle processes; opportunities; risk; spiral;
fLanguage :
English
Journal_Title :
Software, IEEE
Publisher :
ieee
ISSN :
0740-7459
Type :
jour
DOI :
10.1109/MS.2008.145
Filename :
4670715
Link To Document :
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