Title :
MOSFET hot-carrier reliability improvement by forward-body bias
Author :
Hokazono, Akira ; Balasubramanian, Sriram ; Ishimaru, Kazunari ; Ishiuchi, Hidemi ; Hu, Chenming ; Liu, Tsu-Jae King
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fDate :
7/1/2006 12:00:00 AM
Abstract :
Active threshold voltage VTH control via well-substrate biasing can be utilized to satisfy International Roadmap for Semiconductors performance and standby power requirements for CMOS technology beyond the hp65-nm node. In this letter, the impact of substrate bias VSUB on hot-carrier reliability is presented. The impact varies with the gate length and body effect factor. These findings are explained, and the effects of future scaling are discussed using a quasi-two-dimensional model. Significant and important improvement in hot-carrier lifetime with forward-bias VSUB can be expected for deeply scaled CMOS devices, making it an attractive method for extending the scalability of bulk-Si transistor technology.
Keywords :
MOSFET; hot carriers; semiconductor device models; semiconductor device reliability; silicon; CMOS technology; MOSFET; Si; active threshold voltage; body effect factor; forward-body bias; gate length; hot-carrier lifetime; hot-carrier reliability; well-substrate biasing; CMOS technology; Degradation; Hot carriers; MOS devices; MOSFET circuits; Research and development; Scalability; Substrates; Threshold voltage; Voltage control; Forward-body bias; MOSFET; hot-carrier reliability; reverse-body bias; substrate bias;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2006.877306