Title :
Failure mechanism models for ductile fracture
Author :
Dasgupta, Abhijit ; Hu, Jun Ming
Author_Institution :
CALCE Electron. Package Res. Center, Maryland Univ., College Park, MD, USA
fDate :
12/1/1992 12:00:00 AM
Abstract :
This tutorial illustrates design situations where ductile fracture of some components can compromise system performance, thereby acting as an overstress failure mechanism. Analytic (physics-of-failure) methods, based on continuum fracture mechanics principles, are presented to design against such failures. Examples illustrate the use of these models in practical design situations in mechanical engineering and electronic packaging. The design equations are based on continuum mechanics rather than on molecular micromechanics, and can be implemented in an engineering design environment. The associated stress analysis of ten requires numerical finite-element techniques. The methods for material-property characterizations have matured appreciably over the past 40 years and are specified in engineering handbooks
Keywords :
ductile fracture; fracture mechanics; packaging; analytic physics-of-failure methods; continuum fracture mechanics principles; continuum mechanics; ductile fracture; electronic packaging; engineering design; material-property characterizations; mechanical engineering; numerical finite-element techniques; overstress failure mechanism; stress analysis; Design engineering; Educational institutions; Electronics packaging; Failure analysis; Mechanical engineering; Plastics; Reliability engineering; Solid modeling; Strain measurement; Stress;
Journal_Title :
Reliability, IEEE Transactions on