Title :
Foreword Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance Applications
Author :
Canavero, Flavio ; Franzon, Paul D.
Abstract :
The eleven papers in this spection section are devoted to electrical performance analysis and simulation of interconnects, packages and devices composing electronic systems for high-performance applications.
Keywords :
Algorithm design and analysis; Analytical models; Carbon nanotubes; Copper; Electronics packaging; Integrated circuit interconnections; Jitter; Performance analysis; SPICE; Vectors;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2008.2009342
