DocumentCode
988021
Title
Foreword Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance Applications
Author
Canavero, Flavio ; Franzon, Paul D.
Volume
31
Issue
4
fYear
2008
Firstpage
662
Lastpage
663
Abstract
The eleven papers in this spection section are devoted to electrical performance analysis and simulation of interconnects, packages and devices composing electronic systems for high-performance applications.
Keywords
Algorithm design and analysis; Analytical models; Carbon nanotubes; Copper; Electronics packaging; Integrated circuit interconnections; Jitter; Performance analysis; SPICE; Vectors;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2008.2009342
Filename
4674532
Link To Document