• DocumentCode
    988062
  • Title

    Reliability evaluation of class-E and class-a power amplifiers with nanoscaled CMOS technology

  • Author

    Lin, Wei-Cheng ; Wu, Tsung-Chien ; Tsai, Yi-Hung ; Du, Long-Jei ; King, Ya-Chin

  • Author_Institution
    Microelectron. Lab., Nat. Tsing-Hua Univ., Hsinchu, Taiwan
  • Volume
    52
  • Issue
    7
  • fYear
    2005
  • fDate
    7/1/2005 12:00:00 AM
  • Firstpage
    1478
  • Lastpage
    1483
  • Abstract
    Circuit reliability of class-E and class-A power amplifiers is investigated based on a newly developed degradation subcircuit model. Measured degradation characteristics on the fabricated circuits agree well with the simulation predictions. Using this model, we have found that the class-E amplifier degrades faster than a class-A amplifier, due to a much higher stress level during switching. With a drastic decrease of PAE, a shorter lifetime is expected for a class-E amplifier.
  • Keywords
    CMOS analogue integrated circuits; integrated circuit modelling; integrated circuit reliability; nanotechnology; power amplifiers; class-A power amplifier; class-E power amplifier; nanoscaled CMOS technology; reliability evaluation; subcircuit model; Analog circuits; CMOS technology; Degradation; Hot carriers; Power amplifiers; Predictive models; Radio frequency; Radiofrequency amplifiers; Semiconductor device modeling; Stress; Class-A amplifier; Fowler–Nordheim (FN) stress; class-E amplifier; hot-carrier(HC) stress; reliability;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2005.850639
  • Filename
    1459107