Title :
Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling
Author :
Chandrasekar, Karthik ; Wilson, John ; Erickson, Evan ; Feng, Zhiping ; Xu, Jian ; Mick, Stephen ; Franzon, Paul
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC
Abstract :
Multi-Gb/s pulse signaling is demonstrated with inductively coupled interconnects across packaging interfaces. This has application in realizing submillimeter pitch, true zero insertion force (ZIF) surface mount connectors, and sockets. The signaling data rate achieved in this system is from 1 to 8.5 Gbps, which depends on the 3-dB coupling frequency of the composite channel consisting of the inductive interconnections and the transmission lines. This paper presents the results of a set of experiments demonstrating this capability and describes the principles behind the design of inductively coupled sockets and connectors.
Keywords :
electric connectors; signalling; surface mount technology; bit rate 1 Gbit/s to 8.5 Gbit/s; inductively coupled connectors; pulse signaling; sockets; surface mount connectors; zero insertion force; Capacitors; Connectors; Couplings; Frequency; Impedance; Integrated circuit interconnections; Optical signal processing; Packaging; Sockets; Transmission lines; 3-dB coupling frequency; alternating current (ac) coupled interconnect; backplane connectors; fine pitch; impedance matching; inductive coupling; pulse signaling; sockets; zero insertion force;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2008.2005465