DocumentCode :
988454
Title :
Characteristics of \\hbox {HfO}_{2} /Poly-Si Interfacial Layer on CMOS LTPS-TFTs With \\hbox {HfO}_{2}
Author :
Ma, Ming-Wen ; Chiang, Tsung-Yu ; Wu, Woei-Cherng ; Chao, Tien-Sheng ; Lei, Tan-Fu
Author_Institution :
Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu
Volume :
55
Issue :
12
fYear :
2008
Firstpage :
3489
Lastpage :
3493
Abstract :
In this paper, high-performance complementary-metal-oxide-semiconductor low-temperature polycrystalline-silicon thin-film transistors (CMOS LTPS-TFTs) with HfO2 gate dielectric are fabricated on one wafer for the first time. Low threshold voltage and excellent subthreshold swing can be achieved simultaneously for N- and P-channel LTPS-TFTs without hydrogenation. In addition, the impacts of the HfO2 /poly-Si interfacial layer on N- and P-channel LTPS-TFTs are also specified. In order to enhance the characteristics of HfO2 LTPS-TFT further, oxygen plasma surface treatment is employed to improve the interface quality and passivate the defects of channel grain boundaries, thus increasing the carrier mobility and reducing the phonon scattering. The CMOS LTPS-TFTs with HfO2 gate dielectric and oxygen plasma treatment would be suitable for the application of system-on-panel.
Keywords :
CMOS integrated circuits; elemental semiconductors; hafnium compounds; plasma applications; silicon; surface treatment; thin film transistors; HfO2; LTPS-TFT; O2; Si; complementary-metal-oxide-semiconductor; gate dielectric; low-temperature polycrystalline-silicon thin-film transistors; oxygen plasma surface treatment; phonon scattering; plasma surface treatment; poly-Si interfacial layer; system-on-panel; wafer; Dielectrics; Grain boundaries; Hafnium oxide; Phonons; Plasma applications; Plasma properties; Scattering; Surface treatment; Thin film transistors; Threshold voltage; 3-D integration; High-$kappa$; low-temperature polycrystalline-silicon thin-film transistors (LTPS-TFTs); oxygen plasma; system-on-panel (SOP);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2008.2006543
Filename :
4674580
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