When it´s too hot to touch use infrared thermography

Author

Linnander, Benkt

Author_Institution

AGEMA Infrared Syst., Inc., Secaucus, NJ, USA

Volume

9

Issue

4

fYear

1993

fDate

7/1/1993 12:00:00 AM

Firstpage

35

Lastpage

37

Abstract

Infrared (IR) thermography applications in the design, development and production of printed circuit boards (PCBs), hybrid circuits, microcircuits, and other electronic components are described. This noncontact temperature measurement technique can capture a highly accurate record of the thermal dynamics of small objects at intervals as short as 1/30th of a second. It is ideal for studying the heat distribution across boards to determine the optimum layout of components, the effectiveness of proposed heat-dissipation and -removal devices, and the performance of developmental systems under stimulated load conditions. The effects of the emissivity of the object, the ambient temperature, the atmospheric conditions surrounding the object, and its size and distance from the camera on the temperatures observed by the IR camera are discussed.<>

Keywords

infrared imaging; integrated circuit technology; printed circuit design; spectral methods of temperature measurement; temperature distribution; IR camera; PCBs; electronic components; heat distribution; heat-dissipation; hybrid circuits; infrared thermography; microcircuits; noncontact temperature measurement; optimum layout; printed circuit boards; stimulated load conditions; thermal dynamics; Attenuation; Cameras; Electronic components; Hybrid integrated circuits; Lenses; Position measurement; Production; Soldering; Temperature measurement; Temperature sensors;

fLanguage

English

Journal_Title

Circuits and Devices Magazine, IEEE

Publisher

ieee

ISSN

8755-3996

Type

jour

DOI

10.1109/101.250232

Filename

250232