DocumentCode :
990389
Title :
Subscriber line interface circuit LSI fabricated using high-voltage CMOS/SIMOX technology
Author :
Nakashima, S. ; Maeda, Yuji
Author_Institution :
NTT Atsugi Electrical Communication Laboratory, Atsugi, Japan
Volume :
19
Issue :
25
fYear :
1983
Firstpage :
1095
Lastpage :
1097
Abstract :
High-voltage buried-channel CMOS/SIMOX technology which is characterised with the existence of an electric-field-shielding layer formed by oxygen implanatation was applied to fabricate a BSH-LSI for a subscriber line interface circuit, providing three functions of battery feed, supervision and hybrid. In this CMOS BSH-LSI, a high breakdown voltage of higher than 60 V and a low breakdown voltage of 15 V were fabricated by the same process. This BSH-LSI showed a high level of performance during operation. The chip size and dissipation power of the BSH-LSI were reduced to approximately one-third and one-half, respectively, compared with a conventional BSH-LSI fabricated with bipolar technology.
Keywords :
digital communication systems; digital integrated circuits; electronic switching systems; field effect integrated circuits; integrated circuit technology; large scale integration; telephone switching equipment; BSH-LSI; O2 implantation; SLIC; battery feed; breakdown voltage; buried-channel; dissipation power; electric-field-shielding layer; high-voltage CMOS/SIMOX technology; hybrid; separation by implanted O2; subscriber line interface circuit; supervision;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19830743
Filename :
4248305
Link To Document :
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