An interconnected 2D-TM EBG structure for millimeter and submillimeter waves

Author

Schuster, Michael ; Klein, Norbert ; Ruther, Patrick ; Trautmann, Achim ; Paul, Oliver ; Kuzel, Petr ; Kadlec, Filip

Author_Institution

Inst. of Thin Films & Interfaces, Forschungszentrum Juelich, Germany

Volume

23

Issue

7

fYear

2005

fDate

7/1/2005 12:00:00 AM

Firstpage

1378

Lastpage

1384

Abstract

Due to their unique properties, electromagnetic bandgap (EBG) materials are of high interest for applications in communication technology for many frequency bands from microwave up to optical frequencies. We have investigated in both simulation and experiment a two dimensionally periodic EBG structure made by reactive ion etching of silicon with a bandgap for transverse magnetic waves in the millimeter wave range around 100 GHz. The structure comprises both a large bandgap and a high mechanical stability due to interconnecting dielectric bridges.

Keywords

millimetre waves; numerical analysis; optical communication; optical materials; photonic band gap; photonic crystals; silicon; sputter etching; submillimetre waves; Si; communication technology; interconnected 2D-TM structure; interconnecting dielectric bridges; mechanical stability; millimeter waves; periodic electromagnetic bandgap materials; reactive ion etching; silicon etching; submillimeter waves; terahertz waves; transverse magnetic waves; Communications technology; Frequency; Magnetic materials; Metamaterials; Optical materials; Particle beam optics; Periodic structures; Photonic band gap; Submillimeter wave communication; Submillimeter wave technology; Electromagnetic bandgap; microwave; millimeter wave; photonic crystal; silicon etching; terahertz;

fLanguage

English

Journal_Title

Selected Areas in Communications, IEEE Journal on

Publisher

ieee

ISSN

0733-8716

Type

jour

DOI

10.1109/JSAC.2005.851179

Filename

1461498