Title :
SPICE compatible modelling of on-chip coupled interconnects
Author :
Kumar, R. ; Kang, K. ; Rustagi, S.C. ; Mouthaan, K. ; Wong, T.K.S.
Author_Institution :
Inst. of Microelectron., Singapore
Abstract :
On-chip coupled interconnect lines are modelled using measured S-parameters. The physical consistency between single and coupled line model parameters are maintained in the proposed methodology. The SPICE compatible model is validated in both the frequency and the time domain using copper and ultra low-kappa coupled interconnects.
Keywords :
S-parameters; SPICE; integrated circuit interconnections; S-parameters; SPICE; on-chip coupled interconnects;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20072620
