Title :
Transmission of high speed electrical signals in a Josephson package
Author :
Anderson, C.J. ; Klein, M. ; Ketchen, M.B.
Author_Institution :
IBM Thomas J. Watson Research Center, Yorktown Heights, New York
fDate :
5/1/1983 12:00:00 AM
Abstract :
It is proposed that Josephson circuit chips are housed in a three-dimensional, card-on-board package operated near 4.2K. In this technology logic signals travel on matched, low-loss, superconducting transmission lines and through low resistance but inductive package connectors. In an experiment designed to model closely the electrical environment of this package, the waveform of a Josephson driver signal was measured before and after propagation through a card-to-card path in the package. The measurements were made on-chip using Josephson sampling techniques. The degradation in risetime of a 125ps driver signal was less than 20ps; crosstalk to a parallel path through the package was less than 2%. The inductances of right angle and pluggable micropin connectors were determined using an impedance current split experiment. Measured values of about 100pH and 250pH respectively are in good agreement with numerical calculations.
Keywords :
Integrated circuit packaging; Josephson device logic circuits; Connectors; Driver circuits; Electric resistance; Electric variables measurement; Electrical resistance measurement; Josephson junctions; Packaging; Signal design; Superconducting transmission lines; Transmission line measurements;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.1983.1062325