Title :
Effects of an Os Buffer Layer on Structure and Exchange Bias Properties of CoFe/IrMn Fabricated on Si(100) and Si(111)
Author :
Peng, Tai-Yen ; Lo, C.K. ; Chen, San-Yuan ; Yao, Y.D.
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsinchu
Abstract :
The structural and exchange bias properties of CoFe/IrMn prepared on Si (100) and Si (111) with an Os/Cu buffer layer were investigated. Since the Os (0002) surface mesh has the same atomic arrangement as fcc (111) orientation, and the lattice mismatch between Os (0002) and IrMn (111) is as low as 2.6%, the CoFe/IrMn grown on H-Si(100) showed a strong IrMn (111) diffraction peak, while a very weak IrMn (111) peak appeared on H-Si (111). With increasing Os thickness (dOs), the IrMn (200) peak was weakened, while the IrMn (111) became strong on H-Si (100). For the CoFe/IrMn grown on H-Si(111), no obvious structural change appeared. Os plays an important role on tuning the IrMn to result in the exchange bias. On the other hand, CoFe/IrMn showed an exchange field (Hex) on both H-Si(100) and H-Si(111) with the Os buffer layer; however, the magnetization switching process was different due to different the crystalline degree. A sharp magnetization switching process occurs for IrMn(111) on Os/Cu/H-Si(100) with a square hysteresis loop. A 370 and 310 Oe of Hex was found in textured CoFe/IrMn on Os/Cu/H-Si(100) and Os/Cu/H-Si(111), respectively
Keywords :
buffer layers; cobalt alloys; exchange interactions (electron); ferromagnetic materials; interface magnetism; iridium alloys; iron alloys; magnetic hysteresis; magnetic switching; manganese alloys; texture; CoFe-IrMn; Os; Si; atomic arrangement; buffer layer; exchange bias; lattice mismatch; magnetization switching process; square hysteresis loop; structural change; Antiferromagnetic materials; Buffer layers; Crystallization; Magnetic films; Magnetic properties; Magnetic switching; Magnetic tunneling; Magnetization; Magnetoelectronics; Substrates; Buffer layer; osmium; textured film;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2006.888497