Fast Location of Opens in TSV-Based 3-D Chip Using Simple Resistor Chain

Author

Sanming Hu ; Cheng Jin ; Hongyu Li ; Rui Li ; Ser Choong Chong ; Ming Chinq Jong ; Wai, Eva Leong Ching ; Keng Hwa Teo ; Minkyu Je ; Lo, Patrick Guo Qiang

Author_Institution

Inst. of Microelectron., Agency for Sci., Technol. & Res., Singapore, Singapore

Volume

61

Issue

7

fYear

2014

fDate

Jul-14

Firstpage

2584

Lastpage

2587

Abstract

This brief proposes an electrical method using simple resistor chain in parallel to quickly locate open circuits in a 3-D chip. This method is theoretically analyzed using the equivalent circuit, and experimentally validated by a 3-D integrated circuit (3-D IC). The fabricated 3-D IC consists of one printed circuit board, one organic substrate, and seven 65-nm CMOS dies stacked using microbumps and through-silicon vias. Results show that, the proposed parallel resistor chain can efficiently locate opens in a complicated 3-D IC within several minutes, using the resistance measured by power supply or multimeter only.

Keywords

CMOS integrated circuits; equivalent circuits; integrated circuit design; three-dimensional integrated circuits; 3D IC; 3D chip; 3D integrated circuit; CMOS dies; electrical method; equivalent circuit; microbumps; open circuits; organic substrate; parallel resistor chain; printed circuit board; simple resistor chain; size 65 nm; through-silicon vias; Current measurement; Educational institutions; Electrical resistance measurement; Resistance; Resistors; Through-silicon vias; 3-D integrated circuit (3-D IC); location; open; parallel resistor chain; through silicon via (TSV); through silicon via (TSV).;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/TED.2014.2321453

Filename

6817584