• DocumentCode
    995877
  • Title

    Temperature measurement and equilibrium dynamics of simulated annealing placements

  • Author

    Rose, Jonathan ; Klebsch, Wolfgang ; Wolf, Jurgen

  • Author_Institution
    Comput. Syst. Lab., Stanford Univ., CA, USA
  • Volume
    9
  • Issue
    3
  • fYear
    1990
  • fDate
    3/1/1990 12:00:00 AM
  • Firstpage
    253
  • Lastpage
    259
  • Abstract
    One way to alleviate the heavy computation required by simulated annealing placement algorithms is to replace a significant fraction of the higher or middle temperatures with a faster heuristic, and then follow it with simulated annealing. A crucial issue in this approach is the determination of the starting temperature for the simulated annealing phase-a temperature should be chosen that causes an appropriate amount of optimization to be done, but makes good use of the structure provided by the heuristic. A method for measuring the temperature of an existing placement is presented. The approach is based on the measurement of the probability distribution of the change in cost function, PC), and makes the assumption that the placement is in simulated annealing equilibrium at some temperature. The temperature of placements produced by both a simulated annealing and a min-cut placement algorithm are measured, and good agreement with known temperatures is obtained. The PC) distribution is also used to give an interesting view of the equilibrium dynamics of simulated annealing
  • Keywords
    circuit layout CAD; optimisation; probability; CAD; cost function; equilibrium dynamics; layout design; min-cut placement algorithm; optimization; probability distribution; simulated annealing placement algorithms; starting temperature determination; temperature measurement; Computational modeling; Cooling; Cost function; Helium; Laboratories; Probability distribution; Processor scheduling; Simulated annealing; Temperature distribution; Temperature measurement;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.46801
  • Filename
    46801