Title :
Hybrid integration of GaAs-based VCSEL array with amorphous silicon sensor
Author :
Lemmi, Francesco ; Chua, Christopher L. ; Lu, Jeng-Ping
Author_Institution :
Xerox Palo Alto Res. Center, CA, USA
fDate :
6/1/2004 12:00:00 AM
Abstract :
We describe an optoelectronic module incorporating a vertical-cavity surface-emitting laser (VCSEL) array with a semitransparent light monitor. The power monitor is a p-i-n amorphous silicon photodetector fabricated on glass. Sets of micromachined springs for electrical contacting are also fabricated in the same process on the same glass substrate. Hybrid packages are formed by pressing the compliant springs against individual contact pads of the GaAs VCSEL array in a flip-chip assembly process. The light sensor is aligned directly on top of the laser elements. Most of the laser light is transmitted through the sensor, yet a large dynamic range is maintained because of the sensors exceedingly low dark current.
Keywords :
III-V semiconductors; amorphous semiconductors; electrical contacts; gallium arsenide; glass; p-i-n photodiodes; photodetectors; semiconductor laser arrays; surface emitting lasers; GaAs; GaAs-based VCSEL array; amorphous silicon sensor; compliant springs; dark current; dynamic range; electrical contacting; flip-chip assembly process; glass substrate; hybrid integration; hybrid packages; individual contact pads; laser elements; laser light; light sensor; micromachined springs; optoelectronic module; p-i-n amorphous silicon photodetector; power monitor; semitransparent light monitor; transparent sensor; vertical-cavity surface-emitting laser; Amorphous silicon; Contacts; Glass; Monitoring; Optical arrays; PIN photodiodes; Sensor arrays; Springs; Surface emitting lasers; Vertical cavity surface emitting lasers; Amorphous silicon; VCSELs; power monitor; transparent sensor; vertical-cavity surface-emitting laser;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2004.828966