DocumentCode :
997081
Title :
Lateral RESURF MOSFET fabricated on 4H-SiC(0001~) C-face
Author :
Okamoto, Mitsuo ; Suzuki, Seiji ; Kato, Makoto ; Yatsuo, Tsutomu ; Fukuda, Kenji
Author_Institution :
National Inst. of Adv. Ind. Sci. & Technol., Japan
Volume :
25
Issue :
6
fYear :
2004
fDate :
6/1/2004 12:00:00 AM
Firstpage :
405
Lastpage :
407
Abstract :
Lateral reduced surface field (RESURF) metal-oxide-semiconductor field-effect transistors (MOSFETs) have been fabricated on 4H-SiC(0001~) carbon face (C-face) substrates. The channel mobility of a lateral test MOSFET on a C-face was 41 cm2/V·s, which was much higher than 5 cm2/V·s for that on a Si-face. The specific on-resistance of the lateral RESURF MOSFET on a C-face was 79Ω · cm2, at a gate voltage of 25 V and drain voltage of 1 V. The breakdown voltage was 460 V, which was 79% of the designed breakdown voltage of 600 V. We measured the temperature dependence of Ron, sp for the RESURF MOSFET on the C-face. The Ron, sp increased with the increase in temperature.
Keywords :
MOSFET; semiconductor device breakdown; silicon compounds; substrates; wide band gap semiconductors; 1 V; 25 V; 460 V; 4H-SiC(0001) C-face; 600 V; SiC; carbon face substrates; channel mobility; lateral RESURF MOSFET; metal-oxide-semiconductor field-effect transistors; on-resistance; reduced surface field; temperature dependence; Breakdown voltage; Electric breakdown; FETs; Ion implantation; MOSFET circuits; Oxidation; Silicon carbide; Substrates; Temperature dependence; Testing; C-face; Carbon face; MOSFETs; RESURF; SiC; metal–oxide–semiconductor field-effect transistors; mobility; on-resistance; reduced surface field; silicon carbide; temperature dependence;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2004.828970
Filename :
1302241
Link To Document :
بازگشت