مرکز منطقه ای اطلاع رساني علوم و فناوري - Special issue on thermal management for reliability

DocumentCode :

997247

Title :

Special issue on thermal management for reliability

Volume :

Issue :

fYear :

2004

fDate :

6/1/2004 12:00:00 AM

Firstpage :

445

Lastpage :

445

Abstract :

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.

fLanguage :

English

Journal_Title :

Electron Device Letters, IEEE

Publisher :

ieee

ISSN :

0741-3106

Type :

jour

DOI :

10.1109/LED.2004.830831

Filename :

1302255

Link To Document :