• DocumentCode
    997247
  • Title

    Special issue on thermal management for reliability

  • Volume
    25
  • Issue
    6
  • fYear
    2004
  • fDate
    6/1/2004 12:00:00 AM
  • Firstpage
    445
  • Lastpage
    445
  • Abstract
    Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2004.830831
  • Filename
    1302255
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=997247