A Basis for Setting Burn-in Yield Criteria

This simple, useful, and practical approach to assess the cost benefits from using burned-in plastic ICs assumes a simple approximation for early life failure during burn-in and predicts the failure rate of the residual parts on the basis of yield percentage. Because product applications, end-user environment, and device quality vary, the simplicity of this method is obtained at the cost of some rigor. Nonetheless, the results are useful and are consistent with measured data.