DocumentCode
999387
Title
Wireless chip to chip interconnection for multichip modules using leaky wave antennas
Author
Iyer, M.K. ; Seager, Robert D. ; Vardaxoglou, J.C.
Author_Institution
Dept. of Electron. & Electr. Eng., Loughborough Univ. of Technol., UK
Volume
29
Issue
23
fYear
1993
Firstpage
2030
Lastpage
2031
Abstract
A novel interchip communication technique for very high speed multichip modules is presented. The feasibility of using a dielectric guide leaky wave antenna integrated on a chip for transmission and reception is discussed. J-band measurements and predictions based on a model developed using the transmission line matrix (TLM) method are compared.
Keywords
dielectric waveguides; microwave measurement; multichip modules; waveguide antennas; J-band measurements; TLM method; dielectric guide leaky wave antenna; interchip communication technique; multichip modules; transmission line matrix method; wireless chip to chip interconnection;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19931355
Filename
253961
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