Growth and modification of thin a-Si:H/a-Ge:H bi-layers to sacrificial c-SiGe alloys through ArF-Excimer laser assisted processing

A combination of ArF-Excimer laser assisted techniques has been used for depositing and modifying ultra thin amorphous Si/Ge bi-layer structures. The first step consisted in producing, at low substrate temperatures, thin bi-layer coatings through Laser induced Chemical Vapour Deposition (LCVD) in both, large areas as well as in small regions of Si(1 0 0) wafers. In the second step, these bi-layer structures have been modified through Pulsed Laser Induced Epitaxy (PLIE) for obtaining heteroepitaxial SiGe alloys with a thin buried Ge rich layer, while keeping a shallow upper Si rich surface with good crystalline quality. Threshold for epitaxial alloy formation has been determined by Raman spectroscopy and estimated to be above 200 mJ/cm2. Optical profilometry has been used for evaluating the thickness of the structures and the lateral dimensions of patterned features. SEM, TOF-SIMS and XPS have been used to corroborate the results. For testing IC compatibility, some samples have been overgrown with epitaxial Si and etched through conventional IC processing techniques, revealing that the laser processed layers are suitable to be used as sacrificial layers for producing Micro-Electro-Mechanical Systems (MEMSs) or Silicon-on-Nothing (SON) devices.