Title of article
On positive charge annihilation and stress-induced leakage current decrease
Author/Authors
Mondon، F. نويسنده , , Jourdain، M. نويسنده , , Meinertzhagen، A. نويسنده , , Petit، C. نويسنده , , Gogenheim، D. نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1999
Pages
-190
From page
191
To page
0
Abstract
Stress-induced leakage current (SILC) has several components. One of these components increases when the oxide thickness decreases. We show that this component can be reduced by application of a low field of opposite polarity to the stress field or by temperature annealing. When a positive charge is present in the oxide, this charge is also reduced. We show that these two effects are independent.
Keywords
Thermal benchmark IC , Dynamic thermal modeling of IC packages , Measuring of thermal coupling in ICs
Journal title
MICROELECTRONICS RELIABILITY
Serial Year
1999
Journal title
MICROELECTRONICS RELIABILITY
Record number
12867
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