• Title of article

    On positive charge annihilation and stress-induced leakage current decrease

  • Author/Authors

    Mondon، F. نويسنده , , Jourdain، M. نويسنده , , Meinertzhagen، A. نويسنده , , Petit، C. نويسنده , , Gogenheim، D. نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 1999
  • Pages
    -190
  • From page
    191
  • To page
    0
  • Abstract
    Stress-induced leakage current (SILC) has several components. One of these components increases when the oxide thickness decreases. We show that this component can be reduced by application of a low field of opposite polarity to the stress field or by temperature annealing. When a positive charge is present in the oxide, this charge is also reduced. We show that these two effects are independent.
  • Keywords
    Thermal benchmark IC , Dynamic thermal modeling of IC packages , Measuring of thermal coupling in ICs
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Serial Year
    1999
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Record number

    12867