• Title of article

    Measurement and modeling of the annealing kinetics of stress induced leakage current in ultra-thin oxides

  • Author/Authors

    Ghibaudo، G. نويسنده , , Pananakakis، G. نويسنده , , Riess، P. نويسنده , , Brini، J. نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 1999
  • Pages
    -202
  • From page
    203
  • To page
    0
  • Abstract
    The annealing properties of the stress induced leakage current (SILC) for 55 and 65 A thick oxides are investigated. It is demonstrated that the SILC is a fully reversible degradation process and that its generation kinetics are nearly unchanged after successive stressing/annealing cycles. The activation energy and diffusion coefficient of the annealing process has been extracted and shown to be independent of oxide thickness. Moreover the annealing kinetics are quantitatively simulated using a drift-diffusion model with the experimentally extracted parameters.
  • Keywords
    Thermal benchmark IC , Measuring of thermal coupling in ICs , Dynamic thermal modeling of IC packages
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Serial Year
    1999
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Record number

    12872