Title of article :
Mechanics of stretchable electronics with high fill factors
Author/Authors :
Su، نويسنده , , Yewang and Liu، نويسنده , , Zhuangjian and Kim، نويسنده , , Seok and Wu، نويسنده , , Jian and Huang، نويسنده , , Yonggang and Rogers، نويسنده , , John A.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2012
Abstract :
Mechanics models are developed for an imbricate scale design for stretchable and flexible electronics to achieve both mechanical stretchability and high fill factors (e.g., full, 100% areal coverage). The critical conditions for self collapse of scales and scale contact give analytically the maximum and minimum widths of scales, which are important to the scale design. The maximum strain in scales is obtained analytically, and has a simple upper bound of 3tscale/(4ρ) in terms of the scale thickness tscale and bending radius ρ.
Keywords :
Self collapse , Stretchable electronics , Transfer printing , biomimetics , Stretchability and bendability
Journal title :
International Journal of Solids and Structures
Journal title :
International Journal of Solids and Structures