Deposition of superhard TiAlSiN thin films by cathodic arc plasma deposition

Thin films of TiAlSiN were deposited on AISI H13 tool steel substrate using Ti and AlSi cathodes by a cathodic arc plasma deposition system. The influence of the nitrogen pressure, AlSi cathode arc current, bias voltage, and deposition temperature on the mechanical and the structural properties of the films were investigated. The hardness of the film decreased with the increase of nitrogen gas pressure. The hardness of the film increased with the increase of AlSi cathode arc current and the bias voltage. The hardness of the film reached 48 GPa at the deposition temperature of 300 °C and decreased with a further increase of the temperature. Wear and scratch tests were performed on thin films deposited in various conditions. The critical load of the films was above 50 N.