Title of article :
Technologies of Multi Chip Module (MCMs)
Author/Authors :
Boddepalli، Eshwararao نويسنده Aditya Institute of Technology and Management, Tekkali, Srikakulam ,
Issue Information :
روزنامه با شماره پیاپی 2 سال 2012
Abstract :
In the past few years, impressive progress in electronic devices and their packing have been achieved. High energy physicists benefit from this, being able to minimize the amount of materials in their Vertex detectors. MCMs (Multi- Chip Modules) are the latest advanced technologies which are using in FPGA (Field Programmable Gate Array) routing purpose. This paper tries to give a short overview of the existing Multi chip modules used in Routing of an FPGA and focus on the prototyping results of an upcoming multi chip module technologies, called as (multi chip module) MCM_L, MCM_C and MCM_D. By using these technologies the routing complexity reduced and thermal, chemical, mechanical and material effects reduced while comparing with the PCB and IC designing using CAD (Computer Aided Design) tools.
Journal title :
International Journal of Electronics Communication and Computer Engineering
Journal title :
International Journal of Electronics Communication and Computer Engineering