Author/Authors :
Li، نويسنده , , Shuti and Liu، نويسنده , , Chao and Ye، نويسنده , , Guoguang and Xiao، نويسنده , , Guowei and Zhou، نويسنده , , Yugang and Su، نويسنده , , Jun and Fan، نويسنده , , Guanghan and Zhang، نويسنده , , Yong and Liang، نويسنده , , Fubo and Zheng، نويسنده , , Shuwen، نويسنده ,
Abstract :
The performance of GaN based devices could possibly be improved by utilizing the good p-type properties of GaP layer and it provides the possibility of the integration of InAlGaN and AlGaInP materials to produce new devices, if high quality GaP compounds can be grown on III-nitride compounds. In this paper, the growth of GaP layers on GaN by metalorganic chemical vapor deposition (MOCVD) has been investigated. The results show that the GaP low temperature buffer layer can provide a high density of nucleation sites for high temperature GaP growth. Using a 40 nm thick GaP buffer layer, a single crystal GaP layer, whose full-width at half-maximum of the (1 1 1) plane measured by double crystal X-ray diffraction is 580″, can be grown on GaN. The V/III ratio plays an important role in the GaP layer growth and an appropriate V/III ratio can improve the quality of GaP layer. The GaP:Mg layer with hole carrier concentration of 4.2 × 1018 cm−3 has been obtained.
Keywords :
B. Epitaxial growth , C. X-ray diffraction , C. Atomic force microscopy , A. Thin films , A. Semiconductors