Author/Authors :
Mathieson، نويسنده , , K. and Bates، نويسنده , , John R. and Iles، نويسنده , , G.M. and Manolopoulos، نويسنده , , S. and O’Shea، نويسنده , , V. and Passmore، نويسنده , , S. and Prydderch، نويسنده , , M.L. and Rahman، نويسنده , , M. and Seller، نويسنده , , P. and Smith، نويسنده , , K.M. and Thomas، نويسنده , , S.L. and Watt، نويسنده , , J. and Whitehill، نويسنده , , C.، نويسنده ,
Abstract :
Simulated and experimental results are presented from a silicon X-ray pixel detector which is bump bonded to a PAC5 pixel array of read-out electronics. When coupled to a matching, fully depleted silicon detector the pre-amplifier is observed to have a linear response up to 80 keV, and a pulse height resolution of around 1 keV FWHM over the range 13–60 keV. The Monte-Carlo N-Particle code has been used to simulate the detector response under illumination from a variety of energies. The excellent agreement observed between simulation and experiment illustrates the predictive abilities of such packages.
Keywords :
Spectroscopy , SIMULATION , Bump bonding , Impact , MCNP , x-ray imaging , GaAS , Pixel detectors , Silicon
