Title of article :
Microscopic bonding mechanism of welding interface with molten Cu–4Zn deposited on solid-state steel
Author/Authors :
Wang، نويسنده , , Hengzhi and Wang، نويسنده , , Kehong and Zheng، نويسنده , , Rongkun and Satya Prasad، نويسنده , , K. and Ringer، نويسنده , , Simon P.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2008
Pages :
5
From page :
542
To page :
546
Abstract :
An initial characterization was carried out on the heat affected zone between a 30CrMnSi steel and a Cu–4Zn (wt.%) alloy formed from a novel welding technique involving induction melting of a Cu alloy over a steel substrate at 1100 °C. A very thin (∼ 20 nm) reaction interface between the steel substrate and the Cu alloy is shown to play a key role in effecting these joints. This reaction interface is an Fe–Cu rich discrete phase with a FCC structure and substantial coherence to both the steel substrate and the Cu alloy layer. This reaction interface is expected to form under highly non-equilibrium conditions and provides a bridging effect for the join. This is proposed as the major reason for the strength and mechanical integrity of the weld.
Keywords :
Welding , Cu–4Zn alloy , Steel substrate , Interface , Bonding
Journal title :
Materials Characterization
Serial Year :
2008
Journal title :
Materials Characterization
Record number :
2266797
Link To Document :
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